| 1. | Specifications for fully automatic gold wire ball bonder
全自动金丝球焊接机技术条件 |
| 2. | Gold wire for semiconductor devices lead bonding
半导体器件键合金丝 |
| 3. | As a contrast object , gold wire ball bonding technology was also studied
金丝球键合作为对比研究对象引入本文研究范围。 |
| 4. | Method for determining impurities in gold wire for semiconductor lead bonding by icp - aes
键合金丝中杂质元素的icp - aes测定方法 |
| 5. | It shows that the immunosensor using gold wire is more sensitive and more stable
其中，以金丝为基底制备的免疫传感器最灵敏、最稳定。 |
| 6. | As for the immunosensor made of gold wire , the following research has been conducted
对以金丝为基底制备的免疫传感器进行了如下三方面的研究。 |
| 7. | The change of potential from beginning to end ( the potentiometric difference , a e ) is made of quantifying parameter . different substrates such as gold planar , gold wire and silver wire is used to fabricate this immunosensor
用自组装单分子膜( sams )技术在金片、银丝、金丝等不同的基底上固定igg抗体，分别制备了电位型无标记igg免疫传感器。 |
| 8. | The machine is the warp machine which can use variety of materials , particularly applicable to gold wire and silver wire production according to user requirements , the golden , silver thread can be for cored wire or outsourcing wire
该机是一种多种原料用途的包复丝机，特别适用于金（银）丝生产，可根据用户要求，将金（银）丝作芯丝或外包丝使用。 |
| 9. | Copper wire ball bonding is a new technology which is expected to replace the traditional gold wire ball bonding and is of great significance in reducing the cost and improving the reliability of microelectronic components
铜丝球键合是一种有望取代现行金丝球键合工艺的新技术,这一技术对于降低微电子元器件的成本、提高元器件的可靠性具有重要意义。 |
| 10. | The machine is the warp machine which can use variety of materials , particularly applicable to gold wire silver wire production according to user requirements , the golden , silver thread can be for cored wire or outsourcing wire
该机是一种多种原料用途的包复丝机，特别适用于金（银）丝生产，可根据用户要求，将金（银）丝生产，可根据用户要求，将金（银）丝作芯丝或外包丝使用。 |
